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Tag: Dylan Patel

TMSC begins publicly mentioning 1.4-nanometer fabrication for next-gen Apple products

Post author By Chris Barylick
Post date December 15, 2023

If you think a three-nanometer fabrication process is small and power-efficient, chip manufacturer TSMC has publicly commented on its work on a 1.4nm fabrication technology that is likely destined to underpin future Apple silicon chips. In a slide (via SemiAnalysis’s Dylan Patel) from its Future of Logic panel, TSMC disclosed the official name of its […]

Tags 1.4nm, 11, 12, 16, 17, 18, 19, 2015, 2018, 2019, 2020, 2021, 2024, 2025, 2026, 2027, 2nm, A12, A13, A14, A15, A16, A17, A19, Apple, Apple Watch, Bionic, chip, density, Dylan Patel, efficiency, fix, Future of Logic, i15, iPad, iPhone, M1, M2, m3, Mac, manufacturer, Max, N2, N2P, N3B, N3E, n4P, N5, N5P, N7, nanometer, performance, Pro, product, S4, S5, S6, S7, S8, S9, SemiAnalysis, transistor, TSMC, update, XR, XS

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iFixit teardown notes smaller heatsink in new M2-based MacBook Pro notebooks

Post author By Chris Barylick
Post date January 31, 2023

A recent teardown has shown that Apple’s new M2 Pro and M2 Max-based MacBook Pro note feature a considerably smaller heatsink due to supply chain issues. According to recent reports by iFixit and MaxTech, the new MacBook Pro’s revised thermal architecture appears to be caused by the reduced overall footprint of the ‌M2‌ Pro and […]

Tags ABF, Apple, chips, constraint, CPU, Dylan Patel, GPU, heatsink, iFixIt, M2 Max, M2 Pro, Mac, MacBook Pro, Max Tech, memory, modules, notebook, SemiAnalysis, slimmer, SoC, substrate, supply chain, teardown, TSMC