The iPhone SE has arrived for a few users and the official teardown have begun.
As of Wednesday, Chipworks posted a teardown report of the new handset, citing its composition of parts that had largely been borrowed from the iPhone 5s and iPhone 6/6s, with a few new chips thrown in to keep the platform fresh.
The major difference, though, appears to be the A9 processor, which is currently also found on Apple’s flagship iPhone 6s handset.
As for the A9 SoC, the firm notes its Verizon unit came with a chip bearing part number APL1022, meaning it came from Apple partner Taiwan Semiconductor Manufacturing Company. Additionally, a 1604 date code suggests the chip was produced only nine weeks ago. Apple is using system memory from SK Hynix, which appears to be the same 2 gigabyte LPDDR4 mobile DRAM from iPhone 6s.
Apple included NXP’s NFC chip to bring touchless payments to the iPhone SE. Like the iPhone 6s, iPhone SE boasts an NXP 66V10 module that incorporates the Secure Element 008 and an ear-field communications controller labeled NXP PN549. Chipworks said the SE’s InvenSense 6-axis inertial sensor also made its way from iPhone 6s.
The i{hone SE also includes a Skyworks SKY77611 power amplifier module, a Texas Instruments 338S00170 power management IC, Toshiba NAND flash, an EPCOS D5255 antenna switch module and AAC Technologies’ 0DALM1 microphone, the report said. A separate as-yet-unidentified chip could be a new power management IC designed by Apple in cooperation with Dialog Semiconductor.
Apple has yet to release its official first weekend sales numbers, though reports indicate preorders surpassed 3.4 million units in China alone.
Stay tuned for additional details as they become available.
Via AppleInsider and Chipworks